how to align the real location when try to inspect one wafer on the chuck?

wafer

The process of aligning the real location of a wafer on a chuck using VisionPro can be broken down into the following steps:

    Acquire an image of the wafer and chuck using VisionPro's image acquisition capabilities.

    Process the image to determine the position of the wafer on the chuck. This may involve pre-processing the image to remove noise and then using image processing techniques such as thresholding, blob analysis, or edge detection to identify the wafer.

    Calculate the deviation of the wafer from the desired position on the chuck.

    Use the motor control system integrated with VisionPro to move the chuck to align the wafer with the desired position.

    Verify the alignment of the wafer by repeating the image acquisition and processing steps.

These are general steps, and the actual implementation will depend on the specific requirements of your application and the capabilities of your hardware. You may need to consult the documentation and support resources provided by VisionPro to get a better understanding of how to implement these steps in your specific scenario.